| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10M105-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10M105-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10M107-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M107-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M105-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M105-68 |
| filingDate |
1990-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fa1e7ccd38f4cea12b5a58f9946f34e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0448b8c4faf966549ac82edfd9d90d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48f3aab0a5cfe56acf71761dd6919b99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cce2f55a9162e4f30dfad2cf4036c2e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da96399c5f43a239780fa7834b15def6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c116f6dd09e4e2602a70a18334a727d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aacc719a605f6a6d16b03039ef0d41b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1998ad451b658be520a7d14400fb7bd4 |
| publicationDate |
1991-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2023359-A1 |
| titleOfInvention |
Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor |
| abstract |
ABSTRACT OF THE DISCLOSURE A cooling system for a semiconductor element comprises a heat flow path including a thermally conductive member interposed between a surface of the element and a surface of a cooling block for conducting heat between them. The member is slidable relative to at least one of the surfaces at a region on of sliding contact. To reduce wear, without reducing thermal conductivity, at the region of sliding contact, at least one of the thermally conductive member and the surface contacted thereby carries a fixed thin film comprising fluorine-containing lubricant, of thickness preferably in the range 2 nm to 100 nm. The fluorine-containing lubricant is chemically bonded to the surface carrying it, or alternately the thin film comprises the fluorine-containing lubricant and a support layer therefor fixed to the surface carrying said thin film, molecules of said lubricant being anchored in the support layer. |
| priorityDate |
1989-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |