http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2016769-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_657f8fe5931a3364fda9ccca712ad398 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G12B17-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate | 1990-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdef5f141525d50e5e23098d8fb600e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f8d0fa72b7f9de48dd14e0cdfda3e1c |
| publicationDate | 1990-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-2016769-A1 |
| titleOfInvention | Composite emi shield having clean, highly conductive surfaces for conductive bonding |
| abstract | ABSTRACT An EMI shield is disclosed for providing EMI protec-tion. The shield is lightweight, and easily moldable into complex shapes, having conductive mating surfaces provided on opposite sides thereof. The clean, highly conductive mating surfaces are part of an embedded aluminum wire mesh sandwiched between at least two face plies which add strength to the shield. By sandwiching the metal mesh alternately with a nonporous tape, and a barrier tape ply, clean conductive areas can be provided on either side of the shield, easing attachment to adjacent structures. During curing, the tapes prevent direct resin inclusion into the metal mesh. After curing, the nonporous tape is removed to expose the clean, highly conduc-tive mating surfaces. |
| priorityDate | 1989-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.