| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0759
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0577
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-074 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00 |
| filingDate |
1989-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45e6687a338c595e88ffb4f7505c582f |
| publicationDate |
1990-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2006211-A1 |
| titleOfInvention |
Bubble free film/liquid solder mask-coated printed circuit boards by fluid pressurizing |
| abstract |
TITLE BUBBLE FREE FILM/LIQUID SOLDER MASK-COATED PRINTED CIRCUIT BOARDS BY FLUID PRESSURIZING ABSTRACT A method is disclosed of obtaining a bubble free laminate employing an intermediate liquid layer by applying uniform fluid pressure after lamination. |
| priorityDate |
1988-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |