| abstract |
ADHESION PROMOTER Abstract of the Disclosure Described are heat-activatable adhesion promoters for treating the surfaces of metals or synthetic materi-als (plastics) prior to bonding, containing - from 0.1 to 10% by weight of a carbonyl compound having at least one activated double bond, - from 5 to 30% by weight of a polymer having functional groups, - from 0 to 10% by weight of further auxiliary materials, as well as - one or more organic solvent(s) to make 100% by weight. The invention further relates to a process for producing the heat-activatable adhesion promoter and the use thereof for the surface treatment of polymer fibers. |