Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S148-149 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-933 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-958 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-432 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
filingDate |
1989-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1992-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_315cc5fe18693c3c26e808e6c02264b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86a569030744391852eedd73bae4f2ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc7df1567ce07e87b94b83ca94ed1f4b |
publicationDate |
1992-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CA-1308818-C |
titleOfInvention |
Unpinned oxide-compound semiconductor structures and method of forming same |
abstract |
UNPINNED OXIDE-COMPOUND SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING SAME ABSTRACT OF THE DISCLOSURE Unpinned epitaxial metal-oxide-compound semiconductor structures are disclosed and a method of fabricating such structures is described. Epitaxial layers of compound semiconductor are grown by MBE which result in the formation of a smooth surface having a stabilized reconstruction. An elemental semiconductor layer is deposited epitaxially in situ with the compound semiconductor layer which unpins the surface Fermi level. A layer of insulator material is then deposited on the elemental semiconductor layer by PECVD. In one embodiment, the compound semiconductor is GaAs and the elemental semiconductor is Si. The insulator material is a layer of high quality SiO2. A metal gate is deposited on the SiO2 layer to form an MOS device. The epitaxial GaAs layer has a density of states which permits the interface Fermi level to be moved through the entire forbidden energy gap. In another embodiment, the SiO2 deposition completely consumes the interface Si layer so that the resulting MOS device comprises SiO2 directly overlying the GaAs layer. |
priorityDate |
1988-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |