http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1303903-C

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14c9ad767fb6d5e9dabfb770d4e82252
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21D53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 1987-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1992-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbc01f5d3878c5d49523fd782bf7ba45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e8782cdecc86d3ebb451fb8ec30b485
publicationDate 1992-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1303903-C
titleOfInvention Barrier layer and orifice plate for thermal ink jet print head assemblyand method of manufacture
abstract ABSTRACT This application discloses a thermal ink jet print head and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavi-tation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor sub-strate are gold plated and then soldered together to form a good strong solder bond at the substrate - barrier layer interface.
priorityDate 1987-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.