http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1287557-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32df1f25edbf7933e35d2304d2190f77 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate | 1987-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1991-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2f1083934e09041a51881db01232be1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2e92de1ba456aa279044beb8cde13e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e13459a8caf0a8d82bd70a8a9e947bc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9569829cc450590c0eb5785ff0df3fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e11a199aa5d1b6c088c354184d091a9 |
| publicationDate | 1991-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-1287557-C |
| titleOfInvention | Conductive copper paste composition |
| abstract | Abstract of the Disclosure A conductive copper paste composition adapted to yield a highly conductive film receptive to solders without pretreatment is disclosed. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional econimic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits. |
| priorityDate | 1986-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.