http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1275854-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14c9ad767fb6d5e9dabfb770d4e82252 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2202-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1646 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1629 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1628 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1631 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14129 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-05 |
| filingDate | 1987-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1990-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a066a8aa6f4394ac2d01b6ff80723902 |
| publicationDate | 1990-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-1275854-C |
| titleOfInvention | Integrated thermal ink jet printhead and method of manufacture |
| abstract | ABSTRACT This application discloses a novel thermal ink jet printhead and related integrated pulse driver circuit useful in thermal ink jet printers. This combined printhead and pulse drive integrated circuit includes a first level of metalization comprising a refractory metal which is patterned to define the lateral dimension of the printhead resistor. A passivation layer or layers are deposited atop this first level of metalization and patterned to have an opening or openings therein for receiving a second level of metalization. This second level of metalization such as aluminum may then be used for electrically interconnecting the printhead resistors to MOSFET drivers and the like which have been fabricated in the same silicon substrate which provides support for the printhead resistors. Thus, this "on-chip" driver construction enables these pulse driver transistors to be moved from external electronic circuitry to the printhead substrate. |
| priorityDate | 1986-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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