http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1268577-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-00
filingDate 1985-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1990-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b260ee9cb5bfb016a24e49cb2d3f2062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d2432601c46af0fbb35d29630412609
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publicationDate 1990-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1268577-A
titleOfInvention Molding polyamide composition
abstract Abstract of the Disclosure Disclosed is a molding reinforced polyamide composition comprising [A] a polyamide selected from a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 77 mole% of terephthalic acid component units and 23 to 40 mole% of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) 1,6-diaminohexane units and a polyamide composed of (a) aromatic dicarboxylic acid component units comprising 60 to 100 mole% of terephthalic acid component units and 0 to 40 mole% of aromatic dicarboxylic acid component units other than terephthalic acid component units and (b) units of a linear aliphatic alkylene-diamine component having 7 to 18 carbon atoms, and [B] a filler in an amount of 0.5 to 200 parts by weight per 100 parts by weight of said polyamide. This composition has excellent heat resistance characteristics, mechanical properties, chemical and physical properties and molding characteristics in combination.
priorityDate 1984-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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