http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1255623-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5444ddea43506582a30af4002d6fbef
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
filingDate 1985-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1989-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c0491d8ff2429a6da08a4aa856b7844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d42bcadfbace6874645e92a4140bb10
publicationDate 1989-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1255623-A
titleOfInvention High speed copper electroplating process
abstract Abstract of the Disclosure An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of: (a) a bath soluble polyether compound; (b) a bath soluble organic divalent sulfur compound; (c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.
priorityDate 1984-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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