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filingDate 1986-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1987-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1987-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1218956-A
titleOfInvention Process for plasma etching polysilicon to produce rounded profile islands
abstract A PROCESS FOR PLASMA ETCHING POLYSILICON TO PRODUCE ROUNDED PROFILE ISLANDS Abstract of the Disclosure In a silicon integrated circuit manufacturing process a layer of polysilicon is ion implanted with an n-type dopant and etched through a mask with a fluorine:chlorine mixture. The etchant undercuts at the mask to an extent dependent on the ratio of chlorine:fluorine and on the dopant level. By appropriately selecting that ratio and dopant level, polysilicon islands having a rounded profile can be achieved, this being most efficacious for subsequent deposition onto the polysilicon. - i -
priorityDate 1986-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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