| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d669af06cb2abbcd6823699582a97002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3006 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-28 |
| filingDate |
1983-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1987-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6b3f988ebdee9decd4a893ac8343ea6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df0cb249156eafd132d01f22f0f87ccc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f79d3ecc72688e03d35b2b8fdfaa063e |
| publicationDate |
1987-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-1218882-A |
| titleOfInvention |
Soldering alloy for soldering contact materials |
| abstract |
ABSTRACT OF THE DISCLOSURE For directly soldering oxide-containing silver contact materials onto supports soldering alloys containing 20 to 35% by weight of copper and 0.1 to 5% by weight of palladium in addition to silver are used. The soldered joints produced with these solders show an increased service life of the junk-tion zones in switching tests. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6955286-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6168069-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6352196-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6698644-B2 |
| priorityDate |
1982-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |