| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S204-09 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
1983-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1986-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_319faa44addd5f23526197afcfa009b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a517cfea36ff5c4fe31a0bd1b379b532 |
| publicationDate |
1986-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-1212071-A |
| titleOfInvention |
Electrochemical treatment of copper for improving its bond strength |
| abstract |
ABSTRACT OF THE DISCLOSURE A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil. |
| priorityDate |
1982-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |