| abstract |
Photosensitive coating composition and the use thereof for protective purposes Abstract Uniform protective coatings, particularly solder resist masks, on printed circuit boards can be produced with coating compositions having a viscosity of 200 to 700 m Pas at 25°C and comprising a solution of a photosensitive, thermally curable, lacquer-forming substance, wherein there is additionally uniformly dispersed 5 to 50 % by weight of a finely divided filler. |