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filingDate 1982-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1985-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_731b8ca32d938a120e8030e8dac6f4fa
publicationDate 1985-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1187208-A
titleOfInvention Thermal conduction element for semiconductor devices
abstract Thermal Conduction Element For Semiconductor Devices Abstract A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.
priorityDate 1981-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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