| abstract |
Abstract of the Disclosure An electroconductive paste comprising (a) an electroconductive filler, (b) a reactive solvent, and (c) a hardener comprising (c-1) an epoxy resin, (c-2) a latent hardener, and (c-3) an epoxy compound-dialkylamine adduct, the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1) : (c-2) : (c-3) being 100 : 0 to 30 : 0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates. |