http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1177974-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a24a3c0221d072ce6e49d14bf30404b6 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1759 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-5142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53261 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-0417 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-082 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-00 |
| filingDate | 1981-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1984-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9534187dc50e74e1ee38154eb658a584 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1097e68e923ccee8c0a63e8a007e0d4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5708fb6ac6033015e5d7d23873a891a0 |
| publicationDate | 1984-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-1177974-A |
| titleOfInvention | Leadless chip placement machine for printed circuit boards |
| abstract | ABSTRACT OF THE DISCLOSURE Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placament of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90° apart about the central axis of the head. As the tur-ret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, centering and orienting station, and a placement station. Lo-cated between the testing and orienting stations is a chip re-moval station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect de-fective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine. |
| priorityDate | 1981-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.