| abstract |
Abstract A liquid or pasty thermosetting adhesive which can be pregelled, which is suitable for the bonding of moulded parts or for the sealing of folded seams, and which contains (a) a liquid epoxide resin having on avereage more than one epoxide group in the molecule, and (b) dicyandiamide insoluble in the epoxide resin, the adhesive being characterised in that it also contains (c) in an amount of 5 to 50 per cent by weight relative to the epoxide resin, at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which has a softening point of between 60 and 160°C, such as a polyethylene, a poly-propylene or an ethylene/acrylic acid/acrylate terpolymer. |