| abstract |
Abstract of the Disclosure Heat-curable mixtures of epoxide compounds and carboxylic acid metal salt/amine complexes which can be prepared by reacting 1 mol of a carboxylic acid metal salt of the formula in which A? is the anion of a carboxylic acid which con-tains polar substituents or radical and in particular contains an amide grouping, such as monoamidosuccinic acid, benzenesulphonic acid or pyrrolidone-5-carboxylic acid, and Me ? is a divalent metal cation, with 1 mol of a diamine of the formula in which R is an ethylene or propylene radical and R1 and R2 are hydrogen, alkyl having 1 to 4 ? atoms, cyclohexyl, benzyl, 2-aminoethyl or 3-aminopropyl, in a polar organic solvent and in the temperature range from 25 to 200°C, to give complex compounds. The novel curable mixtures have a good storage stability and the cured moulded articles have good mechanical and especially dielectric properties. |