http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1080922-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e9445e5e3626f36e932c6451a928250
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10
filingDate 1976-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1980-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afa09c46a90416fe38a5a5804957ea2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abced8be9f4b7f8ff5b6d78c27d4a556
publicationDate 1980-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-1080922-A
titleOfInvention Moulds
abstract MOULDS ABSTRACT OF THE DISCLOSURE A mold is described for the encapsulation of electrical components with a thermosetting resin composition, particularly components which have either no lead-out wires or such wires which are not suitable for locating the component within the mold. Fitted into opposing walls of the case of the mold are at least one pair of solid plugs of a flexible material, the plugs extending into the interior of the mold and being of a material which has a higher coefficient of cubic expansion than that of which the mold is constructed. The plugs are arranged to grip the component even though the mold walls expand outwards when the mold is heated to cure the thermosetting resin.
priorityDate 1975-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.