| abstract |
A B S T R A C T Polyamide compositions comprising a polyamide, an inorganic filler, an unsaturated compound containing an epoxy group, and an unsaturated silane are disclosed, and processes for their preparation. Typically the polyamide is nylon, the filler is clay, quartz, silica, talc or wollastonite, the epoxy compound containing a double bond is a glycidyl derivative, and the silane is a vinyl-methyl or vinyl methoxyethoxy silane. These compositions show improved physical properties over known filled polyamides. |