| abstract |
ABSTRACT OF THE DISCLOSURE Holding composition comprising from 10 to 50 wt.% of the polycondenation product of an alkylene glycol or a mixture of the l?ttor with up to 20 wt.% of 2,2'-blis(4--hydroxycyclohexyl) propane or a halogenated derivative thereof, with an ethylenically unsaturated bicarboxylic acid and a saturated bicarboxylic acid, having a melting point of at least 60°C, an acid value of less than 50 and a Gardner viscosity from Y to Z3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70°C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields. |