http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-1043497-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e5302e08e56037ff7bc5c9b6fcc29f9 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-20 |
| filingDate | 1973-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1978-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f8bd799ba5a6daafc485701af993306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bec117908bf26f1310acb76782eaea8e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08df00a2478928ec1f9d2fa3ff2437c1 |
| publicationDate | 1978-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-1043497-A |
| titleOfInvention | Thermosetting molding composition |
| abstract | BISPHENOL-A/FORMALDEHYDE RESIN AND MOLDING COMPOSITION THEREFROM ABSTRACT OF THE DISCLOSURE There is described a novel "one-step" bis A-formaldehyde resin and a molding material containing the resin with which one may achieve molded products possessing excellent properties and almost optimum molding characteristics such as excellent molding latitude, low degree of mold shrinkage, high modulus at elevated temperature, a low degree of deformation at elevated temperatures and excellent steam crack resistance and electrical properties. The molding material comprises about 20 to about 70 weight per cent, based on the weight of the material, of a light colored bis A-formaldehyde resin and about 30 to about 80 weight per cent, based on the weight of the material, of a reinforcing filler for the resin. The resin is a "one-step" heat convertible resin (resole) and comprises the product of the reaction of formaldehyde and bis A in the mole ratio of about 2 to about 3.75, in the presence of an alkali metal hydroxide or barium hydroxide condensa-tion catalyst having a pH of about 3 to about 8. The molding material of this invention is particularly desirable in making molded products by the injection molding or transfer molding processes. S P E C I F I C A T I O N |
| priorityDate | 1972-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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