| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74973199515dbabd2310245aab03e282 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0827 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-0805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K101-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 |
| filingDate |
2007-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0124ecff641d89abb8d795773c0d4e97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_476463a8e8329b95abaaae074f34ec10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dff70ea0d1519f4a32941303fb717ac7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a96fc9de85fff54ef598a36cb7b55bd |
| publicationDate |
2013-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
BR-PI0714312-A2 |
| titleOfInvention |
resin transfer molding device and resin transfer molding method |
| abstract |
RESIN TRANSFER MOLDING DEVICE AND RESIN TRANSFER MOLDING METHOD. The present invention relates to an RTM molding device designed to mold a FRP molded body injected a resin composition into a mold and impregnating the molded body therewith. The resin composition is a CCP. A CCP accommodation layer is disposed adjacent the outer side of the molded body. The layer contains the CCP. The layer supplied is supplied with a limit value of Vf, the value defined by the CCP cure characteristics. The layer is supplied with a limit value of Vf, the value defined by the curing characteristics of the CCP and the heat dissipation characteristics of the CCP to the outside. A means for separating the molded body is disposed between the body and the layer. |
| priorityDate |
2006-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |