Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82a9e22a923eca64a02a97f0dfb493ed |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66772 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1248 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1207 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 |
filingDate |
2016-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd7c761afffbab28ddf4d1adc160d48e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af76ce049ddd0f48d3d1a9bd92e54973 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad95288ad871dd07933ec7dc80c234ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f03fdbad81baef63e6200bee696e6f0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfe13cae1a995b885f935d224dc700f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9121ac2e634322218099af6b656beb6b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65adc94ff1ad0678980147fe574cc67a |
publicationDate |
2018-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
BR-112018005734-A2 |
titleOfInvention |
integrated circuits (ics) on a glassy substrate |
abstract |
It is an integrated circuit (IC) that includes a first semiconductor device on a glassy substrate. The first semiconductor device includes a first semiconductor region of a large silicon wafer. ic includes a second semiconductor device in the glassy substrate. The second semiconductor device includes a second semiconductor region of the bulky silicon wafer. ic includes a through substrate trench between the first semiconductor region and the second semiconductor region. the through substrate trench includes a portion disposed beyond a bulky silicon wafer surface. |
priorityDate |
2015-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |