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filingDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3247e6e77254ed4e3ba1f1be6b3a48eb
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publicationDate 2021-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber BR-112015029548-B1
titleOfInvention MANUFACTURING METHOD AND INTEGRATED CIRCUIT SUBSTRATE
abstract PROMOTIONAL DIRECTED SELF-ASSEMBLY ALIGNMENT LAYERS STANDARDIZED NON-LITHOGRAPHICALLY. A method of one aspect includes forming a self-assembly alignment promoting layer directed onto a surface of a substrate having a first patterned region and a second patterned region. A first directed self-assembly alignment promoting material is selectively formed over the first patterned region without using lithographic patterning. The method also includes forming an assembled layer on top of the directed self-assembly alignment promoting layer by directed self-assembly. A plurality of assembled structures are formed, each predominantly including a first type of polymer over the first directed self-assembly alignment-promoting material. The assembled structures are each adjacently surrounded predominantly by a second different type of polymer over the second patterned region. The first directed self-assembly alignment-promoting material has a greater chemical affinity with the first type of polymer than with the second different type of polymer.
priorityDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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