http://rdf.ncbi.nlm.nih.gov/pubchem/patent/BR-112013029221-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85d78c6a4459b5dbbc49c82a4c5c107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B19-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04a662651c5d25d2eaa0777cc8c1c8fd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecf484766c23722bec1125c5ba0bbd13 |
| publicationDate | 2021-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | BR-112013029221-B1 |
| titleOfInvention | curable epoxy resin formulation composition, process for preparing a curable epoxy resin formulation composition, process for preparing an epoxy insulating material and product |
| abstract | curable epoxy resin formulation composition, process for preparing a curable epoxy resin formulation composition, process for preparing an epoxy insulating material and product. the present invention relates to a curable epoxy resin formulation composition useful as insulation for electrical equipment, including (a) at least one liquid epoxy resin; (b) at least one cyclic anhydride hardener; (c) at least one thermally conductive and electrically insulating charge, the charge including a charge treated with epoxy-silane; and (d) at least one amine curing catalyst having no amine hydrogens; the epoxy resin formulation composition after curing provides a cured product with a balance of electrical, mechanical, and thermal properties such as tg, breaking load, dielectric strength, and volumetric resistivity in such a way that the cured product can be used in applications operated at a temperature greater than or equal to 120ºc. . |
| priorityDate | 2011-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.