| abstract |
base mixture of resin additive. the present invention features a resin additive based mixture, which is not only capable of containing a resin additive that has a low melting point at a high concentration but can also be produced continuously, without breaking the wire, and which has a improved surface adhesion. the resin additive base mixture comprises, for 100 parts by weight of a crystalline resin (a), from 100 to 900 parts by weight of a resin additive (b), from 0.1 to 10 parts by weight of a metal salt of an organic acid other than fatty acid (c) and 0.1 to 10 parts by mass of an agent and gelling agent (d), in which the resin additive base mixture is characterized by the fact that the aforementioned resin additive (b) remains in a liquid state when melted with heating to 250 ° c with subsequent cooling to 80 ° c and is thus maintained for 30 minutes. |