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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
filingDate 2002-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_835ffbcc20f36dc5181577405a2bb08f
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publicationDate 2009-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber BG-65604-B1
titleOfInvention SOLUTION FOR CHEMICAL MIXTURE
abstract The invention relates to a solution for chemically destroying, as well as for the deposition of dispersed copper coatings on the dielectrics and metals in a chemical way. The solution contains 5 to 30 g / l copper (II) sulfate pentahydrate, 5 to 15 ml / l formalin (38-40%), 20 to 60 g / l ethylenediaminetetraacetic acid (EDTA) disodium salt 15 g / l of sodium hydroxide, from 1 to 5 mg / l of sodium diethyldithiocarbamate, from 1 to 5 mg / l of potassium hexacyanoferrate (II), from 2 to 6 mg / l of antimony trichloride, from 0.1 to 0.5 g / l nonylphenol polyglycol ether with 10 ethoxy groups, as well as a dispersion of silicon dioxide or titanium dioxide or silicon carbide or a diamond powder or a metal powder or a particle size corundum in the micro- or nanometric region.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106544653-A
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