| abstract |
What is disclosed is a method for producing a raw solder composition (18, 26), which comprises providing a first solder refining slag (16, 24) comprising tin and / or lead, the method further comprising the steps of (i) ) partially reducing (600, 1000) the first solder refining slag, forming a rough solder metal composition and a second solder refining slag (19, 27), followed by separating the second solder refining slag from the raw solder metal composition, (ii) partially reducing (700) 1100) the second solder refining slag, wherein a second lead-tin-based metal composition (10, 29) and a second spent slag (20, 28) are formed, followed by separating the second spent slag from the second lead-tin-based metal composition characterized in that a copper-containing fresh feed (50, 55) is added to step (ii), preferably before reducing the second solder refining lettuce k. |