abstract |
The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites. |