http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2006252649-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db0b60771ae46ae3e56b0d2d0d989e71 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10G35-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C10G75-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10G35-04 |
| filingDate | 2006-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1269da40d37bbb19e8e0d73658642897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a47e7aece970ea0eb0b5ce7b93273d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c13d0367530f43be79669da830ace18a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36ba370ed6f741f55a6c788017751e35 |
| publicationDate | 2012-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | AU-2006252649-B2 |
| titleOfInvention | Method of treating a surface to protect the same |
| abstract | A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer. |
| priorityDate | 2005-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.