http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AT-519160-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0392 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00047 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | AT-519160-B1 |
| titleOfInvention | Method for producing a micromechanical component and micromechanical component |
| abstract | The invention creates a method for producing a micromechanical component and a micromechanical component. The method comprises the steps: forming at least one cavity (12-1, 12-2) in a substrate (10) with an opening on a surface of the substrate (10); Depositing a sealing layer (18) on the surface of the substrate (10) at least until the opening of the at least one cavity (12-1, 12-2) is closed; Forming a first dielectric layer (20) on or on the closure layer (18); Forming at least one passage (30-1, 30-2) to the at least one cavity (12-1, 12-2) through at least the first dielectric layer (20); Introducing (S06) an etching gas (33), against which the first dielectric layer (20) is etch-resistant, through the passage (30-1, 30-2) into the at least one cavity (12-1, 12-2) for etching a cavern in the substrate (10). |
| priorityDate | 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.