| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08 |
| filingDate |
2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34d75607b7f01ab4a2d3dee948565ea7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c83858dfbd89cb5849f0db652644bb02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd919855348ee98c24fd8f71e783be6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b44a625322738598053257f80fd2e1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70c4bd13c0eca3ed6f853c48351485d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3350609f60e95fa199b2ee86edd833ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_541d99c86a90b33ea9a4ba7c25223829 |
| publicationDate |
2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-200403122-A |
| titleOfInvention |
Polishing method, polishing apparatus, and method for producing semiconductor device |
| abstract |
The present invention provides a highly accurate polishing method and polishing apparatus in which an excess metal film can be removed readily and efficiently at the time of planarizing it by polishing. Furthermore, the present invention provides the method for producing semiconductor device using the polishing method and polishing apparatus. The polishing method of the present invention comprises: disposing a substrate on which the metal film is formed oppositely to the counter electrode in the electrolyte, supplying a current to the metal film through the electrolyte, and polishing the surface of the metal film by means of a hard pad. In addition, the polishing apparatus of the present invention has: a polishing apparatus to polish the surface of the metal film formed on the substrate in the electrolyte, which comprises: a counter electrode isposed oppositely to the substrate; electrical power using the substrate as the anode, and using the opposite electrode as the cathode for applying voltage; a polishing pad sliding on the substrate to polish the metal film. |
| priorityDate |
2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |